| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for a photo-semiconductive device, capable of preventing generation of moisture condensation and cloudiness on a cover and capable of preventing separation of the cover from the photo- semiconductive device. SOLUTION: This resin composition for the photo-semiconductive device contains an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler as essential ingredients, wherein an epoxy resin having an epoxy equivalent of <=165 is used as the epoxy resin, and a cured product given from the resin composition has a rate of dimensional change of <=0.1% when the cured product is subjected to moisture absorption for 168 hr at a temperature of 85 deg.C and a relative humidity(RH) of 85% and a coefficient of moisture absorption of >=0.3 wt.% based on the total amount of the cured product. The cured product is made to have the decreased rate of dimensional change and the increased coefficient of moisture absorption.
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