发明名称 SHIELD PROCESSING STRUCTURE AND SHIELDING TREATMENT METHOD OF MULTI-CONDUCTOR SHIELDING WIRE
摘要 <p>PROBLEM TO BE SOLVED: To provide shield processing structure and method of shielding a multi- conductor shielded wire, which can surely prevent short circuiting between a grounding wire and a conductor or the conductors, improve the insulation performance and an electrical performance by surely obtaining electrical contact between the grounding wire and a shielding and a covering member. SOLUTION: A shield processing structure is provided with the multi-conductor shielded wire 1 having a plurality of the shielded conductors 4, an aluminum foil covering member 6 for covering outer circumferences of the shielded conductors 4 and an insulation jacket 7 for covering the outer circumference of the aluminum foil covering member 6, and a pair of resin members 10, 11 having recesses 10b, 11b which correspond to an outer cross-sectional shape of the multi-conductor shielded wire 1. The multi-conductor shielded wire 1 is put between a pair of the resin members 10, 11 and disposed in the recesses 10b, 11b. One end of the grounding wire 13 is interposed between the multi-conductor shielded wire 1 and the resin member 10. Ultrasonic vibration is applied between a pair of the resin members 10, 11 in this interposed state; a contacting part between a conductor 13a and the aluminum foil covering member 6 is formed; and the inner space of the insulation jacket 7 is filled with a heat resistance insulation material 8.</p>
申请公布号 JP2002325328(A) 申请公布日期 2002.11.08
申请号 JP20010128260 申请日期 2001.04.25
申请人 YAZAKI CORP 发明人 IDE TETSUO;MITA AKIRA
分类号 H01B7/17;H02G1/14;H02G15/08;(IPC1-7):H02G1/14 主分类号 H01B7/17
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