| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit that can form a wiring pattern, through holes, and bumps with easily handling and a large degree of flexibility. SOLUTION: A through hole 3 is formed in a conductor wiring layer 1, and a conductor layer 4 for forming a bump is filled in this through hole 3 and therewith the bump 5 projected from the through hole 3 is made. Consequently, the conductor wiring layer 1 having the bump 5 is formed. This conductor layer wiring layer 1 having the bump 5, which has a large degree of flexibility to form the wiring pattern, through holes, and bumps, and can handle separately from an insulative substrate as distinct from the conventional way, provides an effect that the conductor wiring layer 1 having the bump 5 becomes an object of commercial transaction by itself. |
