| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for managing difference between devices by managing a line width and a hole diameter of a semiconductor aligner by using one wafer in which steps are formed. SOLUTION: The steps 2 are formed on a substrate 1 by a semiconductor manufacturing layer, and photoresist is so spread that a film thickness becomes ununiform. By using a region 4 where the photoresist is uniform, exposure is performed by using an aligner. The exposure is performed on each step. As a result, standing wave effect of the line width and the hole diameter can be observed with one wafer. By performing exposure with a plurality of devices, management of difference between devices is enabled.
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