发明名称 RADIATION-CURING, PEELABLE PRESSURE-SENSITIVE ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a radiation-curing, peelable pressure-sensitive adhesive having proper adhesion performances from the beginning of the adhesion of mutual by contacted two cured layers by appling a strong pressure, without deforming an adhesive layer non increasing or losing adhesive strength under the environment where the adhesive is allowed to stand at a high temperature or exposed to water or a high humidity for a long time. SOLUTION: This radiation-curing removable pressure-sensitive adhesive comprises a >=2-functional special urethane (meth)acrylate obtained by reacting (A) at least one polyol represented by the specific formulae with (B) a diisocyanate and (C) a hydroxy(meth)acrylate as an active ingredient.
申请公布号 JP2002322454(A) 申请公布日期 2002.11.08
申请号 JP20010129897 申请日期 2001.04.26
申请人 TOPPAN FORMS CO LTD 发明人 TANAKA AKIFUMI;YOSHIKAWA RIE;FUKUDA YASUHIRO
分类号 B42D15/02;C09J4/02;C09J7/02;C09J175/16;G09F3/03;G09F3/10;(IPC1-7):C09J175/16 主分类号 B42D15/02
代理机构 代理人
主权项
地址