发明名称 |
RADIATION-CURING, PEELABLE PRESSURE-SENSITIVE ADHESIVE |
摘要 |
PROBLEM TO BE SOLVED: To provide a radiation-curing, peelable pressure-sensitive adhesive having proper adhesion performances from the beginning of the adhesion of mutual by contacted two cured layers by appling a strong pressure, without deforming an adhesive layer non increasing or losing adhesive strength under the environment where the adhesive is allowed to stand at a high temperature or exposed to water or a high humidity for a long time. SOLUTION: This radiation-curing removable pressure-sensitive adhesive comprises a >=2-functional special urethane (meth)acrylate obtained by reacting (A) at least one polyol represented by the specific formulae with (B) a diisocyanate and (C) a hydroxy(meth)acrylate as an active ingredient.
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申请公布号 |
JP2002322454(A) |
申请公布日期 |
2002.11.08 |
申请号 |
JP20010129897 |
申请日期 |
2001.04.26 |
申请人 |
TOPPAN FORMS CO LTD |
发明人 |
TANAKA AKIFUMI;YOSHIKAWA RIE;FUKUDA YASUHIRO |
分类号 |
B42D15/02;C09J4/02;C09J7/02;C09J175/16;G09F3/03;G09F3/10;(IPC1-7):C09J175/16 |
主分类号 |
B42D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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