HIGH FREQUENCY CERAMIC PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a high frequency ceramic package having no occurrence of interface peeling of a conductor pattern and a ceramic even when mechanical impact is applied on a heat sink. SOLUTION: In the high frequency ceramic package 10 wherein a ceramic- made frame body 14 provided with the metal-made heat sink 13 and the conductor pattern 16 comprising a high melting point metal on a connection part with the heat sink 13 is formed to be brazed and which has a base substance 11 providing a semiconductor electronic part mounting part 8 on the inside and a ceramic-made cover body 12 which can be airtightly sealed by mounting semiconductor electronic parts on the semiconductor electronic part mounting part 18, the average particle diameter of the metal particles 20 of the high melting point metal is 3.0-4.0μm, and the thickness of the conductor pattern 16 is 40μm or larger.