发明名称 |
Apparatus for placing a semiconductor chip as a flipchip on a substrate |
摘要 |
An apparatus for placing a semiconductor chip as a flipchip on a substrate has a flip device for flipping the semiconductor chip. The flip device is formed as a parallelogram construction which consists of a support bracket, a first and a second swivel arm and a connecting arm. A chip gripper is arranged on the connecting arm. A drive system serves the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.
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申请公布号 |
US2002162217(A1) |
申请公布日期 |
2002.11.07 |
申请号 |
US20020086405 |
申请日期 |
2002.02.28 |
申请人 |
ESEC TRADING SA, A SWISS CORPORATION |
发明人 |
HARTMANN DOMINIK;GRUETER RUEDI |
分类号 |
H01L21/52;H01L21/00;H01L21/58;H05K13/04;(IPC1-7):B23P19/00;H05K3/34 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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