| 摘要 |
<p>1,157,042. Semi-conductor devices. INTERNATIONAL RECTIFIER CORP. 24 May, 1967 [11 July, 1966], No. 24187/67. Heading H1K. A semi-conductor device incorporating a wafer 16 is mounted on a support stud 10 to which an inverted insulating cup 30 is attached by bolts 34, 35, a conducting stud 50 extending through an aperture 32 in the base 31 of the cup 30 to contact the upper surface of the device. Spring washers 56-58 urge the stud 50 on to the device. In the embodiment a silicon wafer 16 is situated between molybdenum expansion plates 17, 18 in a hermetically sealed can comprising two conducting diaphragms 13, 14 and an insulating cylinder 15. Central portions 19, 20 of the diaphragms 13, 14 are pressed into good electrical contact with the wafer 16 by the studs 10, 50. Cooling fins 70-73 having upturned central spacing flanges 80-83 are soldered to an extension of the support stud 10. The wafer 16 may contain one or more junctions.</p> |
