| 发明名称 |
Method for cutting a wafer hard to cut |
| 摘要 |
<p>A method for cutting a wafer hard to cut into sections comprising steps of scribing the wafer so as to form a groove along a cutting line, drilling bores on the grooves at proper intervals and breaking the wafer along the groove. <IMAGE></p> |
| 申请公布号 |
EP0588681(B1) |
申请公布日期 |
2002.11.06 |
| 申请号 |
EP19930402116 |
申请日期 |
1993.08.30 |
| 申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
NAKAMURA, TAKAO |
| 分类号 |
B28D5/00;H01L21/301;H01L21/304;H01L39/24;(IPC1-7):B28D5/00;B28D1/22;H01L21/00 |
主分类号 |
B28D5/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
