| 发明名称 |
POLISHING PAD FOR A SEMICONDUCTOR SUBSTRATE |
| 摘要 |
A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage. |
| 申请公布号 |
EP1011922(B1) |
申请公布日期 |
2002.11.06 |
| 申请号 |
EP19980918462 |
申请日期 |
1998.04.17 |
| 申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
SEVILLA, ROLAND, K.;KAUFMAN, FRANK, B.;ANJUR, SRIRAM, P. |
| 分类号 |
B24B37/22;B24B37/24;B24B41/047;B24D3/32;B24D13/14;H01L21/304;(IPC1-7):B24D3/32;B24B37/04 |
主分类号 |
B24B37/22 |
| 代理机构 |
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