| 摘要 |
PURPOSE: An alloy composition for lead free solder is provided, which shows smooth surface after soldering and has good anti-oxidation surface. CONSTITUTION: The alloy composition for lead free solder comprises Sn, Ag 3.0 to 3.8 wt.%, Cu 0.4 to 0.8 wt.%, an alloy containing at least one metals selected from Ge, Se and Sr, and a balance of Sn wherein Ge, Se and Sr are contained in the alloy composition in an amount of 0.005 to 0.02 wt.%, 0.005 to 0.01 wt.% and 0.005 to 0.1 wt.%, respectively. The alloy composition for lead free solder has a melting point range of 218 to 221°C.
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