SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING IT, AND ELECTROPHOTOGRAPHIC DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the cost of forming a coil. SOLUTION: This semiconductor device has at least an IC chip 2 and a coil 1a connected to the IC chip and transmits information by using an induction field as a transmission medium. Support 1b on which the IC chip is mounted, the coil 1a, and a connecting terminal 1c connected to the coil for making an electrical connection with the IC chip are formed from the same patterned metallic plate.