| 摘要 |
PROBLEM TO BE SOLVED: To excellently wash the edge of a substrate. SOLUTION: In an edge washing box 300 for selectively washing the edge of a wafer W, 2nd washing liquid supply nozzles 331 and 351 are arranged to supply 2nd washing liquid to the edges of the top and reverse surface of the wafer W. The 2nd washing liquid contains an etchant for removing slurry remaining at the edges of the wafer W and also etching unnecessary thin films and pure water. While the etchant is spouted out of the 2nd washing liquid supply nozzles 331 and 351, gas is blown out of gas supply nozzles 336 and 356. The blowing pressure of the gas prevents the etchant spouted out of the 2nd washing liquid supply nozzles 331 and 351 from scattering to the center of the wafer, and the etchant is spouted to the outside the wafer w.
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