| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor inspection device preventing such a phenomenon that the contact uniformity of a semiconductor element and a probe needle is hard to obtain because of the abrasion of the probe needle and the accurate electric characteristics of the semiconductor element can not be obtained by the deterioration of the probe needle. SOLUTION: The probe needle is protected by using a balance element for absorbing pressure in a probe card and accurate electric characteristics can be measured regardless of the dispersion of the contact uniformity in the surface of wafer.
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