| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a conventional device that has low long term reliability and accuracy in temperature compensation because a quartz vibrator and a semiconductor element fixed on a base are shifted. SOLUTION: The quartz device comprises the base 1 that has mounts 1a, 1b on both upper and lower sides and a wiring layer 2 introduced from each of the mounts 1a, 1b toward the outer face, the quartz vibrator 5 that is fixed on the mount 1a on the upper side of the base 1 via a fixing member 8, and the semiconductor element 6 that is fixed on the mount 1b on the lower face of the base 1 via a support plate 9 to compensate the temperature of the quartz vibrator 5. The linear thermal expansion coefficient of the base 1 is 14×10<-6> / deg.C-20×10<-6> / deg.C (40-400 deg.C), and the linear thermal expansion coefficient of the base side of the support plate 9 is 10×10<-6> / deg.C-14×10<-6> / deg.C (40-400 deg.C) and the semiconductor element side of the support plate 9 is 5×10<-6> / deg.C-9×10<-6> / deg.C.
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