发明名称 Light emitting diode layout structure
摘要 An LED layout structure has a substrate, at least one light emitting chip mounted on a front surface of the substrate. A first conductive wire is formed on the front surface of the substrate to connect with a first pole of the light emitting chip, and then the first conductive wire extends to a back surface of the substrate to form two terminals on the back surface. At least one second conductive wire having a first terminal formed on the front surface of the substrate to connect with a second pole of the light emitting chip, and then the second conductive extends to the back surface of the substrate and back to the front surface to form a second terminal. By applying the LED layout structure to form an LED array arrangement, the wire jumping problem is effectively avoided.
申请公布号 US2002158261(A1) 申请公布日期 2002.10.31
申请号 US20010841071 申请日期 2001.04.25
申请人 LEE MING-TANG;LIN CHENG-I;CHAN CHENG-WEI;LAI PING-KUN 发明人 LEE MING-TANG;LIN CHENG-I;CHAN CHENG-WEI;LAI PING-KUN
分类号 H01L25/075;H01L33/62;(IPC1-7):H01L33/00 主分类号 H01L25/075
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