发明名称 |
Light emitting diode layout structure |
摘要 |
An LED layout structure has a substrate, at least one light emitting chip mounted on a front surface of the substrate. A first conductive wire is formed on the front surface of the substrate to connect with a first pole of the light emitting chip, and then the first conductive wire extends to a back surface of the substrate to form two terminals on the back surface. At least one second conductive wire having a first terminal formed on the front surface of the substrate to connect with a second pole of the light emitting chip, and then the second conductive extends to the back surface of the substrate and back to the front surface to form a second terminal. By applying the LED layout structure to form an LED array arrangement, the wire jumping problem is effectively avoided. |
申请公布号 |
US2002158261(A1) |
申请公布日期 |
2002.10.31 |
申请号 |
US20010841071 |
申请日期 |
2001.04.25 |
申请人 |
LEE MING-TANG;LIN CHENG-I;CHAN CHENG-WEI;LAI PING-KUN |
发明人 |
LEE MING-TANG;LIN CHENG-I;CHAN CHENG-WEI;LAI PING-KUN |
分类号 |
H01L25/075;H01L33/62;(IPC1-7):H01L33/00 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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