| 摘要 |
There is provided a semiconductor laser module including (a) a semiconductor laser (208). (b) a cooler (205) which cools the semiconductor laser (208), (c) a package bottom (102) on which the cooler (205) is mounted, (d) a package housing (203, 203A, 203B) mounted on the package bottom (102), the package housing (203, 203A, 203B) cooperating with the package bottom (102) to define a package in which the semiconductor laser (208) and the cooler (205) are arranged, and (e) a ground terminal (106G) outwardly extending from the package housing (203) and electrically connected to a ground terminal of the semiconductor laser (208), characterized by the heat insulator (202) sandwiched between the package bottom (102) and the package housing (203) for preventing heat from being transferred between the package bottom (102) and the package housing (203). <IMAGE> |
