| 摘要 |
1,171,469. Soldering; welding by pressure. NATIONAL SEMICONDUCTOR CORP. 8 July, 1966 [8 July, 1965], No. 14490/69. Divided out of 1,171,467. Heading B3R. [Also in Division H1] The subject-matter of this Specification which has been divided from Specification 1,171,467 is included in that Specification. The claims relate to a machine for attaching semi-conductor bodies to selected ones of lead wires secured in spaced relation to flexible tapes comprising means to feed the tape through the machine and heating means consisting of at least two welding electrodes supported so that they can be lowered into contact with spaced points on one of the wires and raised out of contact. |
