| 摘要 |
A flipchip packaged integrated circuit comprising a substrate, a die and a heatspreader. The die may be configured to electrically attach to the substrate. The heat spreader may be rigidly attached to the die. The die and the heatspreader may have a combined coefficient of thermal expansion when attached. The heatspreader may be configured to match the combined coefficient of thermal expansion and a coefficient of thermal expansion of the substrate.
|
