发明名称 |
DISSIPATORE DI CALORE A FLUIDO PER COMPONENTI ELETTRONICI |
摘要 |
A fluid-cooled heat sink for electronic components comprises a first metal plate (2) designed to be positioned in contact with at least one electronic component (5) and a second plate (6) having a first face (7) and a second face (8). The first face (7) of the second plate (6) is joined to the first plate (2). The first face (7) of the second plate (6) has made in it a groove (9) for a cooling liquid (10). The first face (7) and the second face (8) of the second plate (6) are parallel at least along the length of the groove (9). <IMAGE> |
申请公布号 |
ITBO20010258(A1) |
申请公布日期 |
2002.10.28 |
申请号 |
IT2001BO00258 |
申请日期 |
2001.04.27 |
申请人 |
AAVID THERMALLOY S.R.L. |
发明人 |
ROSSI LUCA;CAPRIZ CESARE;GAVOTTI NICOLO' LUIGI |
分类号 |
H01L23/473 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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