| 摘要 |
PURPOSE: An automatic alignment apparatus for semiconductor package and a method for aligning a semiconductor package by using the same are provided to increase an automation ratio by providing alignment equipment for assembling unit elements. CONSTITUTION: An on-loading portion(20) is installed at one side of a main body(10) in order to load a magazine(1). An off-loading portion(30) is installed at the other side of the main body(10) in order to unload the magazine(1). The first and the second rail(40,41) are installed between the on-loading portion(20) and the off-loading portion(30). The first and the second flipping portion(50,51) are installed in the insides of the first and the second rail(40,41). The first and the second tray(60,61) are installed at outer sides of the first and the second rail(40,41). The first and the second transfer block(70,71) are installed at one side of the first and the second flipping portion(50,51). A test camera(80) is installed in a transfer path of the first and the second transfer block(70,71) or between the first and the second rail(40,41). An on-loader picker(90) and an off-loader picker(100) are used for transferring a package. A tray picker(110) is installed on the first and the second tray(60,61). The first and the second boat pusher(120,121) are installed on the first and the second rail(40,41). A boat feeder unit is used for transferring a boat.
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