发明名称 |
METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic electronic component having small probability of generating a short-circuit defect. SOLUTION: This method of manufacturing comprises a 1st step of reducing void fraction by compressing a ceramic sheet 10a containing ceramic powder and organic substances, 2nd step of forming a conductor layer 2 on the compressed ceramic sheet 10b by using a metallic paste, 3rd step of laminating a plurality of the ceramic sheets 10b on which the conductor layers are formed such that each conductor layer 2 mutually faces via the ceramic sheet 10b to obtain a laminate, and 4th step of firing the laminate. Since the conductor layer 2 is formed on the ceramic sheet 10b after reducing the void fraction, invasion of a metal component into the ceramic sheet 10b is suppressed.
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申请公布号 |
JP2002313673(A) |
申请公布日期 |
2002.10.25 |
申请号 |
JP20020103299 |
申请日期 |
2002.04.05 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
NAGAI ATSUO;SAKAGUCHI YOSHIYA;KURAMITSU HIDENORI |
分类号 |
H01G4/30;(IPC1-7):H01G4/30 |
主分类号 |
H01G4/30 |
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地址 |
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