METHOD OF MANUFACTURING CHIP ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To provide a chip electronic part manufacturing method capable of cutting scribing grooves without hindrance in a ceramic board on which strip-like forms have been outlined with slits. SOLUTION: Slits 3 are cut as longitudinal board splitting grooves in a ceramic board 1, and scribe grooves 14 are cut as lateral board splitting grooves in the ceramic board 1 by irradiating the board 1 with a laser beam 11 while it sweeps the board 1, so that the latticed board splitting grooves can be formed with a peripheral part left as a frame. Thereafter, the ceramic board 1 is split along the splitting grooves into pieces for the formation of chip electronic parts.