| 摘要 |
PROBLEM TO BE SOLVED: To obtain a primer composition for a multilayer printed wiring board which, when printed wiring boards 1 formed with a copper circuit 2 on the surface are laminated via an insulated film or a prepreg 4, is applied for improving adhesive properties between the copper circuit 2 and the insulated film or prepreg 4, and can improve adhesive properties between the copper circuit 2 and the insulated film or prepreg 4 without performing a blackening process, a wet type etching roughing process of copper, or the like on a surface of the copper circuit 2. SOLUTION: An epoxy resin and a sulfur compound are included in a primer. |
