METHOD FOR FORMING WIRING, METHOD FOR ARRANGING ELEMENT USING IT AND METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE

摘要

PROBLEM TO BE SOLVED: To form a via hole easily and to eliminate incomplete conduction by obtaining a good via hole shape. SOLUTION: An insulation layer is formed on a first wiring layer, an opening is made in the insulation layer and then a second insulation layer is formed. When the opening is made, the insulation layer is irradiated with a laser beam while dislocating a focal point. Since the focal point of the laser beam is dislocated, the taper angle of the opening is enlarged and the sidewall has an inclining face and when the wiring layer is formed thereon, the wiring layer also adheres surely onto the sidewall.