发明名称 CONNECTING STRUCTURE FOR ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To make the gaps between leads and caulking sections as narrow as possible by caulking the leads to bus bars by bringing the leads into close contact with the bus bars at the time of caulking the leads to the bus bars. SOLUTION: In the connecting sections 61 of bus bars 57, 58, and 59, broad receiving plates 61A along which coil leads 54 are laid and caulking sections 63 facing the plates 61A are formed. Since the caulking sections 63 are formed in narrow projecting piece-like shapes, the coil leads 54 laid along the plates 61A can be caulked by bending the caulking sections 63 along the leads 54. Consequently, the gaps formed between the leads 54 and the plates 61A and caulking sections 63 can be made as narrow as possible. In addition, since solder surely infiltrates into the gaps, bus bars 57, 58, 59, and 64 can be connected surely to leads 54 and 55.
申请公布号 JP2002313637(A) 申请公布日期 2002.10.25
申请号 JP20010110472 申请日期 2001.04.09
申请人 DENSEI LAMBDA KK 发明人 KAMOI KENJI
分类号 H01F27/28;H01F27/29;H01F37/00;H01R4/18;(IPC1-7):H01F27/28 主分类号 H01F27/28
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