发明名称 SEALING MATERIAL FOR ELECTRICAL/ELECTRONIC APPLIANCE
摘要 <p>A shaped sealing material for electrical/electronic appliances which is free from dust particle adhesion thereto and is easy to handle although it is a sealing material obtained by forming a pressure-sensitive adhesive layer on a foam. A layer comprising a pressure-sensitive adhesive composition having a storage modulas of 20 N/cm2 or higher is formed on a surface of a finely cellular foam to constitute a sealing material having an adhesive force of 5.0 N/20 mm width or higher.</p>
申请公布号 WO2002084918(A2) 申请公布日期 2002.10.24
申请号 JP2002001494 申请日期 2002.02.20
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址