ARRANGEMENT AND METHOD OF ARRANGEMENT OF STACKED DICE IN AN INTEGRATED ELECTRONIC DEVICE

摘要

An integrated device comprises a lead frame having a plurality of inner leads. Furthermore, a first integrated chip is provided that has a plurality of first bond pads for electronically connecting the chip which is attached to the lead frame. A second integrated chip is provided, being smaller than the first chip, and having a plurality of second bond pads. The second chip is attached on top of the first chip. For interconnection, at least one bond wire connects one of the second bond pads of the second chip with one of the first bond pads of the first chip.