| 摘要 |
A wiring substrate has signal transmission paths in a strip line structure implemented through sandwiching of signal wiring layers between first and second conductor layers via first and second dielectric layers. Through holes are formed in the first conductor layer. The through holes are not formed in wiring correspondence regions, which correspond to the signal wiring layers as projected onto the first conductor layer in the thickness direction of the first conductor layer. All of the through holes are formed in a wiring noncorrespondence region, which is the remaining portion of the first conductor layer not including the wiring correspondence regions.
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