发明名称 |
Thin core substrate for fabricating a build-up circuit board |
摘要 |
Disclosed is a method of preparing a thin core substrate for fabricating a build-up multilayer circuit board. The method involves the use of an insulating layer which is covered with the electrically conductive sheets. The openings are made in the electrically conductive layers at the predetermined positions, where the vias are also formed in the insulating layer. An electrically conductive layer is deposited to cover the vias. After the electrically conductive sheets and layer are patterned, a thin core substrate is constructed. The build-up layers are then made at least one side of the thin core substrate to form a build-up multilayer circuit board.
|
申请公布号 |
US2002152611(A1) |
申请公布日期 |
2002.10.24 |
申请号 |
US20010839315 |
申请日期 |
2001.04.20 |
申请人 |
TUNG I-CHUNG;HSIEH HAN-KUN;HSU SHIH-PING |
发明人 |
TUNG I-CHUNG;HSIEH HAN-KUN;HSU SHIH-PING |
分类号 |
H05K3/00;H05K3/46;(IPC1-7):H05K3/02 |
主分类号 |
H05K3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|