发明名称 Polishing pads and methods relating thereto
摘要 Polishing pads are provided having a polishing surface formed from a material. The polishing surface has a topography produced by a thermoforming process. The topography consists of large and small features that facilitate the flow of polishing fluid and facilitate smoothing and planarizing.
申请公布号 US2002155801(A1) 申请公布日期 2002.10.24
申请号 US20020137056 申请日期 2002.05.01
申请人 ROBERTS JOHN V.H.;JAMES DAVID B.;COOK LEE MELBOURNE;JENKINS CHARLES W. 发明人 ROBERTS JOHN V.H.;JAMES DAVID B.;COOK LEE MELBOURNE;JENKINS CHARLES W.
分类号 B24B37/04;B24B41/047;B24D3/26;B24D3/28;B24D13/12;B24D13/14;(IPC1-7):B24D11/00 主分类号 B24B37/04
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