| 摘要 |
A low-profile optically-sensitive semiconductor device is disclosed which includes a substrate with an opening. A cover plate is bonded to a first surface of the substrate in such a manner that a optically-sensitive semiconductor chip is adhered thereto via the opening of the substrate. Right after the semiconductor chip is electrically coupled to the substrate, a first encapsulant with a through hole connected with the opening of the substrate, is formed on the second surface of the substrate. A sealing plate is then attached to the first encapsulant to seal the through hole, so as to hermetically separate the semiconductor chip from the atmosphere. On the first surface of the substrate, a second encapsulant is formed such that ends of the conductive elements and an outer surface of the cover plate are exposed to and flush with a top surface of the second encapsulant. Therefore, a satisfactory manufacturing plane of the semiconductor device can be obtained and the overall height of the semiconductor device can be effectively reduced. <IMAGE> |
