| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition which has excellent heat resistance and, when used for bonding glass, prevents the breakage and improves the thermal impact resistance of the glass. SOLUTION: This adhesive composition contains (a) 100 pts.wt. epoxy resin, (b) 3-15 pts.wt. amide curing agent, (c) 1-20 pts.wt. an aminourea curing agent, (d) 5-500 pts.wt. inorganic fillers, and (e) 0.1-20 pts.wt. a modified epoxy resin.
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