发明名称 METHOD FOR PRODUCING OPC MASK, OPC MASK AND CHIP
摘要 PROBLEM TO BE SOLVED: To provide an OPC(optical proximity correction) mask producing method by which the dispersion of line width of a pattern practically formed on a wafer is suppressed by performing simulation faithfully reflecting the influence of space dependency, an OPC mask and a chip. SOLUTION: The measured data of a new test pattern for a testing mask are obtained by measuring the line width of each gate pattern. Simulation is calculated on the basis of the measured data and the design data of the new test pattern and the simulation data of the new test pattern whose shape is deformed by an optical proximity effect are outputted. When the accuracy of simulation is accepted, a kernel is generated. Simulation is performed by the kernel.
申请公布号 JP2002311562(A) 申请公布日期 2002.10.23
申请号 JP20010115632 申请日期 2001.04.13
申请人 SONY CORP 发明人 ONUMA EIJU;NIIKURA CHIE
分类号 G03F1/36;G03F1/68;G03F1/70;G03F7/20;G06F17/50;H01L21/00;H01L21/027 主分类号 G03F1/36
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