SEMICONDUCTOR PRESSURE SENSOR

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor improved in airtightness holding characteristic. SOLUTION: This semiconductor pressure sensor comprises a semiconductor chip for converting the pressure change of a measuring medium to an electric signal, a resin case for housing the semiconductor chip, a lead terminal drawn out of the resin case and integrally molded therewith, and a connecting member for electrically connecting the semiconductor chip to the lead terminal. The resin case is formed of a thermosetting resin, and the difference between the average linear expansion coefficient from ordinary temperature to post-cure temperature of the thermosetting resin and the linear expansion coefficient of a metal material constituting the lead terminal is set to 3 ppm/ deg.C or less.