| 摘要 |
PURPOSE: A lead wire for electronic component is provided to obtain a solder layer having improved durability by restraining a generating speed of chemical compounds between metals. CONSTITUTION: The first plating layer(30) is deposited on a surface of a conductive substance(20). The second plating layer(40) is deposited on the first plating layer(30). The conductive substance(20) of a lead wire(10) is formed by a conductive material such as a group of Cu or Cu alloy. The first plating layer(30) is formed by Ni and the second plating layer(40) is formed by a group of Sn or Sn-Bi alloy selected from Sn alloys including Sn-Ag alloy, the Sn-Bi alloy, Sn-Cu alloy, Sn-Zn alloy, Sn-In-Ag alloy, Sn-Zn-In alloy, and Sn-Bi-Ag-Cu alloy.
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