发明名称 POSITIVE TYPE PHOTORESIST COMPOSITION
摘要 PURPOSE: To provide a positive type photoresist composition which solves the problem of development defects in the production of semiconductor devices and is excellent also in suitability to halftone exposure. CONSTITUTION: The positive type photoresist composition contains: a compound which contains at least (A1) a sulfonate compound of a sulfonium and (A2) a sulfonate compound or a disulfonyl diazomethane compound of N- hydroxyimide and generates an acid when irradiated with active light or radiation; and a resin which contains repeating units each having a specified lactone structure and is decomposed by the action of the acid to have its alkali solubility increased.
申请公布号 KR20020079483(A) 申请公布日期 2002.10.19
申请号 KR20020018519 申请日期 2002.04.04
申请人 FUJI PHOTO FILM CO., LTD. 发明人 AOAI TOSHIAKI;FUJIMORI TORU;KODAMA KUNIHIKO;SATO KENICHIRO
分类号 C08F20/12;G03F7/004;G03F7/039;H01L21/027;(IPC1-7):G03F7/039 主分类号 C08F20/12
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