发明名称 FORMING METHOD FOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To obtain a precise fine wiring pattern after heating, regardless of whether a photoresist pattern prior to the heating is fine or coarse. SOLUTION: Photoresists 3a and 3b, where the photoresist patterns are drawn, are irradiated with light beams 11a to 11d, 12a, and 12b for heating through masks 5a and 5b forming opening parts corresponding to the photoresist pattern. Consequently, only the light beams 12a and 12b pass through the masks 5a and 5b and heat the photoresists nearby wiring corresponding parts of the pattern, so unwanted thermal shrinkages are not caused, as compared with the conventional methods which heat the whole photoresists and a fine photoresist pattern is obtained. The irradiation is intermittently carried out and it is made hard to conduct heat from the photoresists irradiated with the irradiating light beams to the photoresists shaded from the irradiating light beams.
申请公布号 JP2002305142(A) 申请公布日期 2002.10.18
申请号 JP20010173782 申请日期 2001.06.08
申请人 SONY CORP 发明人 KAWASHIMA ATSUSHI
分类号 G03F7/11;G03F7/40;H01L21/027;H01L21/28;H01L21/3213 主分类号 G03F7/11
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