CIRCUIT STRUCTURE AND ITS MANUFACTURING METHOD, AND WIRING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a circuit structure which is manufactured by an easier method than before and a manufacturing method for the circuit structure. SOLUTION: This circuit structure has a plurality of conduction path layers each having at least one conduction path transmitting light or electricity and at least one inter-layer separation layer provided between the conduction path layers. A plurality of input/output parts are each connected to one of the conduction paths. The conduction paths each has a 1st laminate structure including a plurality of 1st conduction layers and at least one inter-layer separation layer provided between the 1st conduction layers. The inter-layer separation layer has a 2nd laminate structure including a plurality of 2nd separation layers and at least one 2nd conduction layer provided between the 2nd separation layers.