MANUFACTURING METHOD FOR ACTIVE ELEMENT ARRAY BOARD

摘要

PROBLEM TO BE SOLVED: To provide an active element array board capable of preventing a short circuit between packaged terminals even if a thick interlayer insulating film is used, without changing tact in manufacturing, and to provide a manufacturing method therefor. SOLUTION: Even when the interlayer insulating film 7 is formed thick, the resist residues in the pointed projecting parts 7c provided between the packaged terminals 6a which are the interlayer insulating film end parts 7b and adjoin each other, are eliminated.