| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device where the electrode of a semiconductor chip is rearranged and also high connection reliability can be obtained in the connection with an external device, etc., and a stack structure using it. SOLUTION: In the semiconductor device, which has a plurality of electrode pads 2 on the surface of a semiconductor substrate 1, and on which the first insulating layer 10 provided with an opening 9 in the section of that electrode pad 2 is made, and which is equipped with lead wiring 6 being led out from the plural electrode pads 2 and an external connector terminal region 7 to which one end of the lead wiring 6 is connected, on that first insulating layer 10, the first insulating layer 10 has the first opening 14 at the section of the external connector terminal region 7. |
