| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an arm for carrying wafer, with which necessity to reset the height of the arm (carry-in height or lift quantity) for each of thickness of wafers is eliminated. SOLUTION: This arm is provided with two arm parts 22, which are parallel located, while respectively having at least one wafer adsorbing part 23, capable of adsorbing and carrying a wafer and an arm support part 21 for supporting the arm parts, two arm parts 22 are inserted closely to respective wafer support parts 11, which are provided inside a cassette 10, while facing each other, for supporting the wafer and the arm support part is configured to carry the wafer at a prescribed interval in the moving direction of the relevant arm to the peripheral part of the wafer so as not to collide with the wafer inside the relevant cassette, when being inserted into the cassette.</p> |
