| 摘要 |
This invention relates to a polishing machine for polishing an article such as a semiconductor wafer. The movable arm is located at a liquid supply position for supplying a liquid such as a polishing liquid onto a polishing surface of a turntable. The arm is also adapted to be moved to and held at a retracted position radially outside the polishing surface. At the liquid supply position, liquid supply nozzles supported on the arm are brought into a condition that the nozzles are close to a position on the polishing surface where the liquid is to be supplied whereby the liquid is accurately supplied onto the position. Holding the arm at the retracted position makes it easy to conduct a maintenance work for the polishing surface and so on. <IMAGE> |
