Process for contacting an electrical component, especially a semiconductor component, to a substrate comprises applying a connecting unit between the electrical component

摘要

Process for contacting an electrical component (2), especially a semiconductor component, to a substrate (1) having a conducting structure (3) comprises applying a connecting unit having a melting point at which the substrate is not damaged between the electrical component and the conducting structure; and melting the connecting unit and solidifying to form a permanent electrically conducting connection. The joining temperature is raised above the glass transition temperature of the substrate so that the substrate plastically deforms with exertion of a pressure on the electrical component and the electrical component is pressed together with the conducting structure into the substrate. Preferred Features: The conducting structure has conductor lines (3) and a contact site. The connecting unit is arranged between a contact of the electrical component and a contact site of the conductor lines.