| 摘要 |
A cooling device for an electronic component is specified, which is built up from a stack (1) of profiled plates (2a; 2b) lying on one another and connected to one another and, at the end of the stack, termination plates (3) are provided in the stacking direction (x), at least one of the termination plates (3) being designed to make extensive contact with the electric component. Furthermore, at least one of the profiled plates (2a) has a flexible extension (4), the extension (4) projecting beyond the cross section of the stack (1). In addition, a cooling system with at least two such cooling devices is disclosed.
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