| 摘要 |
A lead frame of the present invention is a lead frame used for the production of semiconductor package, wherein each of terminals to be wire-bonded of the lead frame between electrodes provided on the top surface of semiconductor device mounted on a die pad and the terminals has one or two groove(s) for limiting plating area of noble metal for wire-bonding. A semiconductor package of the present invention is produced using the lead frame. Since grooves are provided in each terminal, the accuracy of plating area can be easily checked by visual observation. Accordingly, the cut of inspection cost can be carried out. Further, the grooves absorb stress applied to terminal when molded semiconductor packages are separated individually from each other by means of punching or dicing. Accordingly, coming off of molding compound from terminal is prevented. Further, since the grooves absorb stress applied to terminal by vibration after mounting a semiconductor device on the printed circuit board, the reliability of assembly is improved. Further since molding compound is inserted into grooves of terminal, the adhesion of terminal to molding compound is improved so that moisture is difficult to be absorbed between terminal and molding compound. Accordingly, the reliability of semiconductor is improved.
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