| 摘要 |
<p>A joint for joining a silicon disc (21) to a molybdenum disc (22) comprises a layer of titanium silicide (20) and a layer of aluminium-silicon solder (23). The titanium silicide is formed by depositing a layer of titanium on the silicon disc and heating the silicon disc and the titanium to around 550 DEG C. to encourage the formation of titanium silicide. A solder disc is then compressed between the silicon and molybdenum discs at about 690 DEG C. to fuse the solder to the titanium silicide layer and the molybdenum disc. The layer of titanium silicide protects the silicon disc from dissolution during soldering, so that diffused-in features in the silicon are not damaged.</p> |
