| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component at a low cost and without using an organic solvent having a problematic waste disposal, when the electronic component is manufactured by wet-etching a laminate which is composed of a conductive inorganic substance layer, an insulation layer and a conductive inorganic substance layer, or by wet-etching an insulation layer in a laminate, which is composed of a conductive inorganic substance layer and the insulating layer. SOLUTION: The laminate which is composed of the conductive inorganic substance layer 2, the insulating layer 1 and the conductive inorganic substance layer 3 is wet-etched, the layers 2, 3 are patterned, and the insulation layer 1 is wet-etched so as to be patterned. The insulation layer 1 in the laminate can be wet-etched, and it is of a single-layer structure or of a laminated structure by two or more insulating unit layers, the insulation layer is wet-etched to conduct patterning by using dry film resists 4, 5, and the electronic component is manufactured. |
