| 摘要 |
PROBLEM TO BE SOLVED: To provide a treatment device for wafer such as a filming device or a heat treatment furnace, with which a temperature can be controlled by a proper temperature control treatment method (recipe) without operation even if a temperature setting value or the like is erroneously inputted. SOLUTION: In the treatment device for wafer heating a treatment chamber for treating a wafer, a holding means for holding the wafer to be put into the treatment chamber and a moving means for making the holding means enter/leave the treatment chamber, as sensor reading parts, a flag (projecting part) (7) and a flag (recessed part) (8) are provided on a board base part (11), the treatment device for wafer has a sensor part (flood side and light-receiving side 10) provided to detect the sensor reading parts, while the holding means is located outside the treatment chamber, and a control part for automatically inputting recipe parameters, corresponding to a signal detected by the sensor part or treatment device for wafer, is provided with a control part for comparing the signal detected by the sensor part with the manually inputted recipe parameters.
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