发明名称 METHOD OF CONTROLLING AMOUNT OF SOLDER BALL AND SOLDER BALL FEEDER
摘要 PROBLEM TO BE SOLVED: To keep solder balls in a solder ball tray proper in amount always and to enable a pickup head to always carry out a solder ball suction operation stably. SOLUTION: A solder ball tray 2 is vibrated by a vibration generator 6, solder balls 1 (amount of solder balls is so set as to cover 50% or so of the area of the bottom of the tray 2) residing in the solder ball tray 2 are nearly uniformly scattered on the bottom, the density of solder balls 1 residing in a prescribed region in the solder ball tray 2 is detected in this state by a solder ball sensor 7, the amount of solder balls in the solder ball tray 2 is estimated, and a solder ball replenishing command signal is outputted to a solder ball replenishing mechanism 8 when it is judged that the solder balls are required to be replenished.
申请公布号 JP2002299808(A) 申请公布日期 2002.10.11
申请号 JP20010105493 申请日期 2001.04.04
申请人 ASURIITO FA KK 发明人 FUJIMORI YOSHIHARU
分类号 B23K3/06;H01L21/60;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K3/06
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